Feature
| Coating method | Spin-Coating |
Dip-Coating |
Potting |
|---|---|---|---|
| Membrane thickness of CYTOP |
10 μm or less | 1 μm or less | 1 to 20 μm |
| Shape of substrate | Flat board (or sheet), Circular board | Any type of board may be used. | Any type of board may be used. |
| Control factors of membrane thickness |
Solution concentration, Solution viscosity, spining speed |
Solution concentration, Solution viscosity, Pull-up speed |
Solution concentration, Nozzle shape |
| Thickness controllability | Highly accurate | Highly accurate if dip coater is used | Variable |
| Suitable CYTOP series | CTX-800 series CTL-800 series Solvent: CT-solv180 |
CTX-100E series CTL-100E series Solvent: CT-solv100E |
CTX-100E series CTX-800 series |
Notes: Whichever coating method is used, it can be repeated several times to give the thickness. In such case,
after applying the first coat, let it dry uncompletely before applying another coat (1~10 minutes at 70~120°C).
Any bubbles in the CYTOP liquid must be removed before drying.
Pretreatment method of base material
| Type of base material | Pretreatment method (for use with Standard grade A) | Applications |
|---|---|---|
| Glass | Treatment with silane coupling agent (H2NC3H6Si (OC2H5)3, etc.) Dilution solvent: ethanol, water, etc. Concentration: 0.001 to 0.05% Solvent drying (spin drying, etc.) |
Glass, Quartz, Silicon wafer |
| Metal | No special pretreatment is required. (Silane coupling pretreatment similar to that for glass is also effective.) |
Iron, SUS, Aluminum, Silver, etc. |
| Plastic | Treatment with primer (CT- P10: Containing 15% of active constituent) Dilution solvent: Isopropyl alcohol acetic acid isobutyl in a ratio of 9:5, etc. Concentration: 0.1 to 1% Solvent drying (nitrogen blow, etc.) |
PMMA, PC, PS, PSF, etc. |
Example of CYTOP curing conditions
* This is only an example for reference. Please examine and determine the optimum conditions.
80°C × 60 min. (oven) + 200°C × 60 min. (oven)
