| Unit | Characteristic value | Remarks | |
|---|---|---|---|
| Specific gravity | 2.03 | ASTM D792 | |
| Glass-transition temperature | °C | 108 | DSC |
| Melting point | °C | not observed | |
| Contact angle (water) | degree | 112 | Contact angle gauge |
| Contact angle (normal hexadecane) | degree | 53 | Contact angle gauge |
| Critical surface tension γc | mN/m | 19 | |
| Water absorptivity | % | <0.01 | |
| Yield strength | MPa | 40 | Tensiron |
| Yield strain | % | 5.0 | Tensiron |
| Tensile strength | MPa | 41~49 | Tensiron |
| Tensile elongation | % | 162~192 | Tensiron |
| Tensile modulus | MPa | 1400~1600 | Tensiron |
| Bending strength | MPa | 70 | ASTM D790 |
| Bending modulus | MPa | 2000 | ASTM D790 |
| Compression strength | MPa | 30 | ASTM D695 |
| Compression modulus | MPa | 2900 | ASTM D695 |
| Poisson’s ratio | 0.42 | ||
| Durometer hardness | HDD81 | JIS K7215 | |
| Izod impact strength | kPa·m | 40 | JIS K7110 |
| Thermal deformation temperature | °C | 90 | 1.82MPa Deflection temperature under load |
| 100 | 0.45MPa Deflection temperature under load | ||
| Specific heat | J/(kg·K) | 861 | JIS K7123 |
| Thermal conductivity | W/(m·K) | 0.12 | Laser flash method |
| Linear expansion coefficient | ppm/°C | 115~ 120 | TMA(0~ 80°C) |
| Volume resistivity | Ω·cm | >1017 | JIS K6911 |
| Dielectric constant | 2.0~2.1 | 100Hz to 1MHz, Room temperature, JEC-6150 | |
| 2.04~2.05 | 1GHz to 25GHz, Room temperature | ||
| Dielectric loss tangent | 1 to 8×10-4 | 100Hz to 1MHz, Room temperature, JEC-6150 | |
| 3 to 4×10-4 | 1GHz to 25GHz, Room temperature, Triplate rail resonance method | ||
| Dielectric strength | kV/mm | 20 | 2.3mm in thickness, JIS C2110 |
| kV/0.1mm | 10 | 0.14mm, JIS C2110, Triplate rail resonance method | |
| Arc resistance | Sec | 200< | JIS K6911 |
| Refractive index | 1.34 | Abbe’s refractometer JIS K7142 to 25°C or higher | |
| Photoelastic coefficient | ×10-12Pa-1 | 6.5 | |
| Photo-elastic sensitivity | ×10-6m/N | 0.108 |
