A product in which a fluoropolymer resin such as PTFE or FEP is applied to one or both sides of a polyimide (PI) film. It has excellent temperature resistance, chemical resistance, mechanical strength, electrical insulation and mold release properties, and can be used for electronic parts, semiconductor products, and mold releasing films for fuel cell production processes.


  • Excellent heat resistance(temperature for continuous use FEP : ~200℃、PTFE : ~260℃)
  • Excellent release property (non-stick)
  • Excellent chemical resistance
  • Excellent electrical insulation


  • Semiconductor packaging process
  • Fuel Cell production process
  • Electrical insulation
  • Insulation for flexible heater and so on

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