EUV Photomask Blanks
AGC started its development of new materials and processes for EUV mask blanks, which are essential for production process of leading edge semi-conductor chips.
Plasma-resistant Coating for Semiconductor Manufacturing Equipment
Yttrium Coating(Y₂O₃/Y₅O₄F₇)
The ion-assisted deposition method achieves dense, high hard coatings.
Improved plasma resistance helps extend component life.
LOTEC-MD
High Purity Cordierite
High Purity Cordierite has the following features:
- Low replacement frequency of parts by excellent plasma corrosion
- Reducing detect rates by extremely cutting down impurity contamination
- Improving throughput by excellent thermal shock resistance (Low CTE)
- Flexible shape design (complicated shape)
Ceria Slurry for Semiconductor CMP Process
AGC delivers slurries and polishing solutions for CMP processes as the fully integrated manufacturer from abrasive production.
To realize multi-layered structures with high levels of flatness and zero defects, we optimize our slurries with high planarization and selectivity control technologies for not only silicon-based materials such as poly-Si, SiO2 and SiN, but also metals and resin that fulfill various technical requirements from CMP processes in semiconductor front-end, back-end, packaging and so on.
Fluon® ETFE FILM
Fluon® ETFE is a high-performance fluorine-based plastic film. Fluoropolymer films are used around the world because they exhibit exceptional transparency, antifouling properties and durability. Fluon® ETFE Film has the following features:
- Resistance for heat and chemical
- Properties of mechanical, anti-stick and electrical
- Light transmittance
- Weatherability
Glass Core/Interposer
TGV Glass Substrate for Advanced Packaging
AGC can make through vias in thin glass substrate by the patterns of customers’ requirements. AGC expects TGV substrate in the use of 3D integration for semiconductor packaging, and other wide variety of fields.
- Precise fine pitch small TGV and Cavity formation
- Available in wide variety of glass composition and thickness (0.2-1.0mm)
- High aspect ratio (up to 20:1) at 1.0mmt
- High modulus and CTE adjustability for Warpage Control
- Panel format production (e.g. 510x515mm)
Glass Carrier for Semiconductor Packaging
This glass substrate is suitable as a carrier substrate for the process in semiconductor packaging.
It is characterized by flatness and smoothness.
The shape corresponds to wafers such as Φ300 mm or panel sizes such as 500 mm square.
Optical Interface for Si-Photonics & CPO
Polymer and Glass Optical Waveguide (POW and GOW)
POW and GOW have the following features:
- High transmittance (O-band/C-band)
- Reflow compatibility / high-power laser durability
- Fine patterning by photolithography
Optical Interface for Si-Photonics & CPO
Optical Components for CPO
Aspherical glass molded lenses improve the optical performance of precise equipment.
Micro lens arrays, made of glass, offer higher light resistance compared to molded resin products and have stable thermal characteristics.
They can be used in applications that require high reliability. Transmission grating is another term used in the statement.
Fluon+™ EA-2000
Fluon+™ EA-2000 is a unique fluoropolymer that challenges the conventional notion that fluoropolymers are non-adhesive.
It combines high adhesion with the excellent properties of fluoropolymers, such as heat resistance and electrical characteristics. It offers enhanced adhesion and dispersion capabilities.
Fluoropolymer Fluon® ETFE/PFA, Fluoroelastomer AFLAS® FFKM
AGC's high quality fluoropolymer resins are both reliable and versatile in application.
They offer varying characteristics such as environmental toughness, purity, low melting point, non-stickiness, and resistance to chemicals and weather.