What is CCL?
It is an abbreviation for Copper Clad Laminate.
CCL is formed by lamination of copper foil onto both sides of resin impregnated glass fabric sheets. After processing the end products are electronic circuits as part of printed wiring boards.
AGC develops and manufactures a full range of RF and Digital Materials, including thermoset and thermoplastic copper clad laminates and prepreg / bondply substrates, which provide high reliability and superior thermal, mechanical and electrical performance. Thermoplastic materials are designed for critical RF/Microwave components, antennas, power amplifiers and subassemblies. Superior mechanical and electrical performance make the PTFE resin system the material of choice for your lowest loss, high frequency applications. Thermoset materials are intended for use in core routers, high speed switches, supercomputers, next-generation radio communication and applications where low signal attenuation, high reliability and high data transfer rates are critical.
Applications
- High-speed communications (4G and 5G antenna, power amplifiers, base stations and radar)
- Avionic, aerospace and defense systems
- Automotive - ADS radar and automotive EV / HEV
- Medical and industrial instruments
- Digital electronic circuit boards
- Radio Frequency and microwave
Features
- Wide range of products for both digital and RF applications
- Materials focused on high reliability, dielectric loss criteria and superior thermal, mechanical and electrical performance.
- Global production and sales support
- Reach and RoHS compliant materials
- Cutting-edge Engineering and product development
About product lineup
AGC provides laminate products that can be used in a variety of applications.
Multi Material Division manages AGC’s CCL business.
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