November 27, 2024Exhibitions & Events

SEMICON Japan 2024

AGC to showcase innovative solutions at the semiconductor-related exhibition in Tokyo Big Sight

AGC will exhibit Glass Carrier used for advanced packaging of semiconductors, Through Glass Vias, as well as Film, Synthetic Fused Silica, and Resin products used in semiconductor manufacturing processes and equipment.

In addition, AGC will highlight its commitment to fluorinated material recycling, in line with AGC Chemicals’ Vision of “Chemistry for a Blue Planet,” aiming to contribute to an environmentally friendly and sustainable recycling-oriented society.

This exhibition covers a wide range of topics, with a focus on semiconductors, which are at the core of cutting-edge technology and support the DX era.

Over 1,000 companies and organizations are scheduled to exhibit, including manufacturing technology, equipment, materials, and SMART applications such as cars and IoT devices in the semiconductor industry.


Date: December 11-13, 2024


Location: Tokyo Big Sight

【AGC Booth】

 ・Booth: 1018


Exhibited Products: 

・Fluorine-related Recycling Initiatives

・Fluon® ETFE Film

・Fluon® ETFE, Fluon® PFA, AFLAS® FFKM

・RESIFA Silica

・Through Glass Vias

・Polymer Optical Waveguide/Glass Optical Waveguide

・Optical components for CPO

・Glass substrate for semiconductor packaging

・Synthetic Fused Silica

Please see here for the details

Media inquiries
AGC Inc. Electronics Company Advanced Semiconductor Packaging Group Business Development
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