April 23, 2026Exhibitions & Events
SEMICON SEA 2026
Showcasing innovative Semiconductor Materials and Solutions
AGC provides materials and equipment components used across a wide range of semiconductor manufacturing processes. At this exhibition, we will showcase glass substrates for advanced packaging, glass carriers for wafer and panel applications, films used in semiconductor manufacturing processes and production equipment, resin products, and more.
In addition, we will introduce our fluorochemical recycling initiatives aimed at contributing to an environmentally friendly, sustainable circular society.

This exhibition will feature a wide range of topics, with a focus on Adavanced Packaging, Process and Equipment Innovation to meet Energy and Emissions Efficiency.
Over 1,000 companies and organizations are scheduled to exhibit, including manufacturing technology, equipment, materials, alongside Advanced Packaging summits, AI-driven manufacturing and chip design forums.
Date:May 5-7 2026
Location:Malaysia International Trade and Exhibition Centre, Kuala Lumpur
【AGC Asia Pacific Booth, Level 2, Hall 6】
・Booth: A2748
Exhibited Products:
・3DP SiSiC
・Glass Substrate for Semiconductor Packaging
・AMOLEA™ 1224 YD Refrigerant Gas
・Synthetic Fused Silica Glass AQ series
・Blind Cavity
Please see here for the details
- Media inquiries
- AGC Asia Pacific
Rachel Goh - E-mail: rachel.goh@agc.com
