AGC began conducting R&D on photomask blanks to be used in semiconductor production processes using EUV lithography technology in 2003. In 2017, AGC started production of EUVL mask blanks by advancing technology development combining its proprietary technologies in glass materials, glass processing, and coating. AGC will gradually make the necessary investments in response to market needs as the world's only EUVL mask blank manufacturer capable of handling all processes from glass materials to coating. In July 2020, it decided on a major expansion project*2, including building expansion, at Group company AGC Electronics, where production started in January 2022.
*1 DRAM: An abbreviation for Dynamic Random Access Memory. It is a type of semiconductor memory device and is generally used as a main memory for PCs.
*2 "AGC to Make Drastic Expansion to Supply System for EUVL Mask Blanks", announced July 27, 2020.
EUVL mask blanks are a low-thermal expansion glass substrate with various kinds of optical coating films on its surface. An EUV photomask comprises a semiconductor chip circuitry pattern formed onto the surface of an EUVL mask blank, and this circuit is transferred onto a silicon wafer in order to create a semiconductor chip. The requirements for EUVL mask blanks are rising as circuits become ever finer, such as very small defects as close to zero as possible and very high flatness.
|AGC Electronics Co., Ltd.
|300 million yen
|Head office location
|Koriyama, Fukushima Prefecture
|Glass frit and paste, optical pickups and other optoelectronic products, synthetic silica products for semiconductor manufacturing equipment, EUV lithography photomask blanks