December 1, 2025Exhibitions & Events
SEMICON Japan 2025
AGC to showcase innovative solutions at the semiconductor-related exhibition in Tokyo Big Sight.
AGC provides materials and equipment components used across a wide range of semiconductor manufacturing processes. At this exhibition, we will showcase glass carriers for advanced packaging, glass substrates with microvias for glass core applications, films used in semiconductor manufacturing processes and production equipment, resin products, and more.
In addition, we will introduce our fluorochemical recycling initiatives aimed at contributing to an environmentally friendly, sustainable circular society.
This exhibition will feature a broad range of themes centered on semiconductors—the core of cutting-edge technologies and a key enabler of the era of digital transformation (DX).
More than 1,000 companies and organizations are scheduled to exhibit, covering semiconductor manufacturing technologies, equipment, and materials, as well as medtech and smart applications that leverage AI for semiconductor manufacturing and inspection.
Date: Dec. 17-19 2025
Location: Tokyo Big Sight
【AGC Booth】
Booth: E6246
Featured Products
・Sustainable PTFE: Case Studies for Realizing a Circular Fluorine Society
・Silicon Carbide
・Moisture Proof Coating Agent
Co-Packaged Optics
・Polymer and Glass Optical Waveguide
・Optical components for CPO
・TGV Glass Substrate for Advanced Packaging
・Single-layer Graphene
Solutions for Semiconductor Process ＆ Equipment
・Ion-exchange membranes and electrolyte polymer dispersions
・ETFE, PFA, FFKM
・Ceria CMP Slurry
・Glass Carrier for Semiconductor Packaging
・Low-Dk/Df Silica Fillers
・ETFE Film
Please see here for the details
- Media inquiries
- AGC Inc. Business Development Div.
- E-mail: agc-ml.bddsemiconjp@agc.com
